Method and apparatus for monitoring plasma processing operations

Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus – With microwave gas energizing means

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

2042983, 20429832, 20419213, 20419233, 216 59, 216 60, 438 7, 438 9, 438 8, 438 14, C23F 102, C23C 1400, G01L 2130

Patent

active

061653128

ABSTRACT:
The invention generally relates to various aspects of a plasma process, and more specifically the monitoring of such plasma processes. One aspect relates in at least some manner to calibrating or initializing a plasma monitoring assembly. This type of calibration may be used to address wavelength shifts, intensity shifts, or both associated with optical emissions data obtained on a plasma process. A calibration light may be directed at a window through which optical emissions data is being obtained to determine the effect, if any, that the inner surface of the window is having on the optical emissions data being obtained therethrough, the operation of the optical emissions data gathering device, or both. Another aspect relates in at least some manner to various types of evaluations which may be undertaken of a plasma process which was run, and more typically one which is currently being run, within the processing chamber. Plasma health evaluations and process identification through optical emissions analysis are included in this aspect. Yet another aspect associated with the present invention relates in at least some manner to the endpoint of a plasma process (e.g., plasma recipe, plasma clean, conditioning wafer operation) or discrete/discernible portion thereof (e.g., a plasma step of a multiple step plasma recipe). A final aspect associated with the present invention relates to how one or more of the above-noted aspects may be implemented into a semiconductor fabrication facility, such as the distribution of wafers to a wafer production system.

REFERENCES:
patent: Re32156 (1986-05-01), Tokuda et al.
patent: 3985712 (1976-10-01), Garst
patent: 4278060 (1981-07-01), Isobe et al.
patent: 4289188 (1981-09-01), Mizutani et al.
patent: 4355615 (1982-10-01), Asano et al.
patent: 4362596 (1982-12-01), Desilets et al.
patent: 4415402 (1983-11-01), Gelernt et al.
patent: 4457820 (1984-07-01), Bergeron et al.
patent: 4491499 (1985-01-01), Jerde et al.
patent: 4493745 (1985-01-01), Chen et al.
patent: 4504920 (1985-03-01), Mickowski
patent: 4507605 (1985-03-01), Geisel
patent: 4541718 (1985-09-01), Osada et al.
patent: 4602981 (1986-07-01), Chen et al.
patent: 4609426 (1986-09-01), Ogawa et al.
patent: 4609810 (1986-09-01), O'Brien et al.
patent: 4611919 (1986-09-01), Brooks, Jr. et al.
patent: 4615761 (1986-10-01), Tada et al.
patent: 4675072 (1987-06-01), Bennett et al.
patent: 4721083 (1988-01-01), Hosaka
patent: 4771230 (1988-09-01), Zeh
patent: 4810335 (1989-03-01), Hieber
patent: 4846928 (1989-07-01), Dolins et al.
patent: 4847792 (1989-07-01), Barna et al.
patent: 4847817 (1989-07-01), Au et al.
patent: 4936967 (1990-06-01), Ikuhara et al.
patent: 5014217 (1991-05-01), Savage
patent: 5047612 (1991-09-01), Savkar et al.
patent: 5118378 (1992-06-01), Moroi et al.
patent: 5160402 (1992-11-01), Cheng
patent: 5168699 (1992-12-01), McCarty et al.
patent: 5169407 (1992-12-01), Mase et al.
patent: 5200023 (1993-04-01), Gifford et al.
patent: 5210704 (1993-05-01), Husseiny
patent: 5223683 (1993-06-01), Ishizaka
patent: 5280983 (1994-01-01), Maydan et al.
patent: 5283418 (1994-02-01), Bellows et al.
patent: 5288367 (1994-02-01), Angell et al.
patent: 5290383 (1994-03-01), Koshimizu
patent: 5308414 (1994-05-01), O'Neil et al.
patent: 5326975 (1994-07-01), Barna
patent: 5343412 (1994-08-01), Birang
patent: 5347460 (1994-09-01), Gifford et al.
patent: 5405488 (1995-04-01), Dimitrelis et al.
patent: 5424633 (1995-06-01), Soiferman
patent: 5428444 (1995-06-01), Haddock et al.
patent: 5450205 (1995-09-01), Sawin et al.
patent: 5455061 (1995-10-01), Matossian et al.
patent: 5467013 (1995-11-01), Williams et al.
patent: 5467883 (1995-11-01), Frye et al.
patent: 5471401 (1995-11-01), Nicholson et al.
patent: 5500076 (1996-03-01), Jerbic
patent: 5526293 (1996-06-01), Mozumder et al.
patent: 5546322 (1996-08-01), Gifford et al.
patent: 5551982 (1996-09-01), Anderson et al.
patent: 5552016 (1996-09-01), Ghanayem
patent: 5565114 (1996-10-01), Saito et al.
patent: 5602757 (1997-02-01), Haseley et al.
patent: 5614055 (1997-03-01), Faribairn et al.
patent: 5641375 (1997-06-01), Nitescu et al.
patent: 5647913 (1997-07-01), Blalock
patent: 5647953 (1997-07-01), Williams et al.
patent: 5654796 (1997-08-01), Mundt
patent: 5656902 (1997-08-01), Lowrance
patent: 5658423 (1997-08-01), Angell et al.
patent: 5711843 (1998-01-01), Jahns
patent: 5728253 (1998-03-01), Saito et al.
patent: 5739051 (1998-04-01), Saito
patent: 5841651 (1998-11-01), Fu
"Real-Time Etch Plasma Monitor System", IBM Technical Disclosure Bulletin, vol. 25, No. 11A, pp. 5721-5723, Khoury (Apr. 1983).
"A Plasma Process Monitor/Control System", Surface and Interface Analysis, vol. 24, pp. 124-133, Joel O. Stevenso Pamela P. Ward, Michael L. Smith, and Richard J. Markle (Feb. 1998).
U.S. application No. 09/065,203, Smith, Jr. et al., Apr. 23, 1998.
U.S. application No. 09/064,966, Smith, Jr. et al., Apr. 23, 1998.
U.S. application No. 09/065,245, Smith, Jr. et al., Apr. 23, 1998.
U.S. application No. 09/065,006, Smith, Jr. et al., Apr. 23, 1998.
U.S. application No. 09/065,359, Smith, Jr. et al., Apr. 23, 1998.
U.S. application No. 09/064,793, Smith, Jr. et al., Apr. 23, 1998.
U.S. application No. 09/064,957, Smith, Jr. et al., Apr. 23, 1998.
U.S. application No. 09/065,680, Smith, Jr. et al., Apr. 23, 1998.
U.S. application No. 09/064,991, Smith, Jr. et al., Apr. 23, 1998.
U.S. application No. 09/065,257, Smith, Jr. et al., Apr. 23, 1998.
U.S. application No. 09/065,307, Smith, Jr. et al., Apr. 23, 1998.
U.S. application No. 09/065,274, Smith, Jr. et al., Apr. 23, 1998.
U.S. application No. 09/064,970, Smith, Jr. et al., Apr. 23, 1998.
U.S. application No. 09/065,247, Smith, Jr. et al., Apr. 23, 1998.
U.S. application No. 09/064,965, Smith, Jr. et al., Apr. 23, 1998.
U.S. application No. 09/065,195, Smith, Jr. et al., Apr. 23, 1998.
U.S. application No. 09/065,362, Smith, Jr. et al., Apr. 23, 1998.
U.S. application No. 09/064,972, Smith, Jr. et al., Apr. 23, 1998.
U.S. application No. 09/065,358, Smith, Jr. et al., Apr. 23, 1998.
"Process Uniformity for Plasma Etchback and Desmear in Printed Wiring Board Manufacturing", Sandia Report, SAND96-1954; UC-706, pp. 1-5, Pamela P. Ward, Michael L. Smith, Joel O. Stevenson, Rick Smedley (Aug. 1996).
"Sandia Computer Program Saves Money for Microchip and Circuit Board Makers", Handout at Ceremony at Sandia National Laboratories, pp. 1-3 (Oct. 1997).
Schiller, On The Investigation of D.C. Plasmatron Discharges By Optical Emission Spectrometry, Oct. 1982, pp. 235-240.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method and apparatus for monitoring plasma processing operations does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method and apparatus for monitoring plasma processing operations, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for monitoring plasma processing operations will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-990852

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.