Method and apparatus for monitoring etching

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step

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156627, 156643, 156646, 156345, 204298, 20419233, H01L 21306, B44C 122, C03C 1500, C23F 102

Patent

active

046094261

ABSTRACT:
This invention relates to a method and apparatus for monitoring etching. The monitor method comprises the steps of regulating a gas pressure inside a treating chamber, in which a sample is being etched by a dry etching process, to a pressure at which a emission line spectrum can be clarified, converting the gas whose pressure is regulated to plasma, and monitoring the etching state of the sample from the change of the intensity of the emission line spectrum with time. The monitor apparatus comprises exhaust means for discharging a gas from a treating chamber in which a sample is being etched by a dry etching process, plasma means for introducing the gas discharged from the treating chamber and converting it plasma, pressure regulation means for regulating the pressure of the gas at the plasma means to a pressure at which a emission line spectrum can be clarified, and spectrum detection means for detecting the emission line spectrum of the plasma at the plasma means, and detecting the change of the intensity of the detected emission line spectrum with time.

REFERENCES:
patent: 4263088 (1981-04-01), Gorin
patent: 4345968 (1982-08-01), Coe
patent: 4356055 (1982-10-01), Montier
patent: 4415402 (1983-11-01), Gelernt et al.

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