Method and apparatus for monitoring and controlling the flatness

Details Method and apparatus for monitoring and controlling the flatness Method and apparatus for monitoring and controlling the flatness

1997-10-02

1999-09-14

Rose, Robert A.

Abrading

Precision device or process - or with condition responsive...

With feeding of tool or work holder

451 56, 451443, 451 6, B24B 5300

Patent

active

059513705

ABSTRACT:
A laser element is mounted above a polishing pad of a workpiece polishing machine to monitor and control flatness of the pad. Actual flatness of the pad is determined by a computer processor which receives thickness measurements from the laser element and compares the thickness at the inner diameter portion of the pad with the thickness at the outer diameter portion of the pad. If the flatness varies substantially from a target flatness, a conditioning device mounted on the machine is moved appropriately relative to the pad to conform its flatness to the target flatness.

REFERENCES:
patent: 4693012 (1987-09-01), Cesna
patent: 5456627 (1995-10-01), Jackson et al.
patent: 5486131 (1996-01-01), Cesna et al.
patent: 5618447 (1997-04-01), Sandhu
patent: 5664987 (1997-09-01), Renteln
patent: 5665201 (1997-09-01), Sahota
patent: 5708506 (1998-01-01), Birang
patent: 5736427 (1998-04-01), Henderson
patent: 5801066 (1998-09-01), Meikle

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