Method and apparatus for microjoining dissimilar materials

Details Method and apparatus for microjoining dissimilar materials Method and apparatus for microjoining dissimilar materials

2007-05-10

2010-11-09

Landau, Matthew C (Department: 2813)

Semiconductor device manufacturing: process

Making device or circuit responsive to nonelectrical signal

Physical stress responsive

C438S050000, C438S106000, C438S700000, C438S701000, C438S084000, C257S415000, C257SE29070, C174S354000, C174S367000

Reexamination Certificate

active

07829363

ABSTRACT:
Disclosed are apparatus and methods that provide for electrical contacts in a substrate. For example, the apparatus may comprise a trench formed in a substrate, with an electrical contact pad formed on interior walls of the trench that comprises a narrowed opening. A conductive wire is squeezed into the trench that is secured by mechanical stress resulting from material deformation. One exemplary method comprises depositing metal on walls of the trench such that a narrowed opening is provided, and disposing a conductive wire in the trench so that it contacts the deposited metal and is secured by mechanical stress resulting from material deformation. Another exemplary method comprises providing a substrate having a trench formed therein, placing a conductive wire in the trench, and depositing metal atoms into the trench to bury the wire and provide exposed metal on a surface of the substrate.

REFERENCES:
patent: 4297565 (1981-10-01), Parr
patent: 4414607 (1983-11-01), Sekido et al.
patent: 5708251 (1998-01-01), Naveh
patent: 5846854 (1998-12-01), Giraud et al.
patent: 6053743 (2000-04-01), Mitchell et al.
patent: 6855115 (2005-02-01), Fonseca et al.
patent: 2003/0136417 (2003-07-01), Fonseca et al.
patent: 2005/0187482 (2005-08-01), Fonseca et al.
patent: 2006/0177956 (2006-08-01), O'Brien et al.
patent: 2006/0241354 (2006-10-01), Allen et al.
patent: 2006/0287602 (2006-12-01), O'Brien et al.
U.S. Appl. No. 10/215,377, filed Aug. 7, 2002, Fonseca, et al.
U.S. Appl. No. 10/215,379, filed Aug. 7, 2002, Fonseca, et al.

Affiliated with

Also associated with

Rating

Method and apparatus for microjoining dissimilar materials does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method and apparatus for microjoining dissimilar materials, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for microjoining dissimilar materials will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4191885