Method and apparatus for metallization of large area substrates

Details Method and apparatus for metallization of large area substrates Method and apparatus for metallization of large area substrates

2006-04-18

2006-04-18

Edwards, Laura (Department: 1734)

Coating apparatus

Solid applicator contacting work

With work-handling or work-supporting

C118S212000, C118S264000, C118S046000, C101S368000, C101S379000, C101S474000

Reexamination Certificate

active

07029529

ABSTRACT:
A system and method for processing large area substrates. In one embodiment, a system for processing large area substrates includes prep station, a stamping station and a stamp that is automatically moved between the stamping station and the prep station. The stamping station is adapted to retain a large area substrate thereon. The stamp has a patterned bottom surface that is adapted for microcontact printing. The prep station is for applying a precursor to the patterned bottom surface of the stamp. In one embodiment, a method for processing large area substrates includes the steps of disposing a large area substrate on a platen, inking a stamp adapted for microcontact printing, and automatically contacting a bottom of the stamp to the large area substrate supported on a platen.

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