Image analysis – Applications – Manufacturing or product inspection
Patent
1993-07-15
1995-10-17
Boudreau, Leo H.
Image analysis
Applications
Manufacturing or product inspection
348 87, 348126, 356369, 356400, 364490, 364559, G06K 900, G01J 400, H04N 718
Patent
active
054597943
ABSTRACT:
A measuring method and apparatus for automatically and accurately measuring the sizes of portions of a hybrid integrated circuit chip and circuit patterns formed thereon or a wiring board and wiring patterns formed thereon. An image of a portion of a hybrid integrated circuit chip or wiring board is obtained through a TV camera which provides image signals representing images including those of objective portions. The image signals are processed to calculate the positions of the objective portions automatically. The size of an arbitrary objective portion is determined from a difference between respective positions of other objective portions.
REFERENCES:
patent: 4866629 (1989-09-01), Chen et al.
patent: 4922308 (1990-05-01), Noguchi et al.
patent: 5050111 (1991-09-01), Ayata et al.
patent: 5127061 (1992-06-01), Amir et al.
Ninomiya Takanori
Yamamura Hisae
LandOfFree
Method and apparatus for measuring the size of a circuit or wiri does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method and apparatus for measuring the size of a circuit or wiri, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for measuring the size of a circuit or wiri will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-604261