Semiconductor device manufacturing: process – With measuring or testing
Reexamination Certificate
2008-07-29
2008-07-29
Estrada, Michelle (Department: 2823)
Semiconductor device manufacturing: process
With measuring or testing
C257SE21529, C257SE21521
Reexamination Certificate
active
07405089
ABSTRACT:
In order to measure a surface profile of a sample, an imprint of the surface profile to be examined is produced in a transfer material. The sample contains processed semiconductor material and is in particular a patterned semiconductor wafer or part of a patterned semiconductor wafer. The transfer material is deformable and curable under suitable ambient conditions. The transfer material may be a thermoplastic material or a material which is deformable as desired after application on a substrate and cures in one case by means of irradiation with photons having a suitable wavelength or alternatively heating. The transfer material may be configured in such a way that the imprint produced is the same size as or alternatively of smaller size than the surface profile. The imprint produced is subsequently measured by known methods.
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Bloess Harald
Guittet Pierre-Yves
Mantz Ulrich
Reinig Peter
Weidner Peter
Dicke Billig & Czaja, PLLC
Estrada Michelle
Infineon - Technologies AG
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