Method and apparatus for manufacturing multi layer printed circu

Details Method and apparatus for manufacturing multi layer printed circu Method and apparatus for manufacturing multi layer printed circu

1984-01-13

1986-08-19

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

29852, 29848, 156150, 156233, 156247, 156634, 156645, 156656, 156666, 156902, 204 15, 427 97, 430315, 430318, C23F 100, B44C 122, C03C 1500

Patent

active

046067876

ABSTRACT:
Methods and apparatus for providing fine line, high density multiple layer printed circuit board packages are disclosed. In the method for fabricating multiple layer printed circuit board package, a printed circuit board is formed having a conductive circuit pattern embedded in and integral with an insulator material substrate, such that the surface of the conductive circuit pattern is exposed along one surface of the substrate, and lays flush and coplanar with therewith. At least two of said boards are stacked with a layer of insulator material interposed between each pair of adjacent boards. The entire assembly is heat-pressed together to form a homogenous block of insulator material having conductive circuit patterns embedded and integrally molded therein.

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