Method and apparatus for manufacturing a semiconductor device

Semiconductor device manufacturing: process – With measuring or testing

Reexamination Certificate

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Details

C029S025010, C257SE21529, C257SE21521

Reexamination Certificate

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07402444

ABSTRACT:
A method of manufacturing a semiconductor device using a wafer emissivity calculated from a wafer reflectivity to calculate a wafer temperature and to calculate target values for heat source optical intensities provided to a plurality of heat sources which heat the wafer and a substrate peripheral structure.

REFERENCES:
patent: 6780657 (2004-08-01), Ino et al.
patent: 2005/0112788 (2005-05-01), Borden et al.
patent: 2006/0100735 (2006-05-01), Hauf et al.
patent: 2001-274109 (2001-10-01), None

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