Method and apparatus for making printed circuit boards

Details Method and apparatus for making printed circuit boards Method and apparatus for making printed circuit boards

1993-08-27

1994-08-02

Powell, William

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156634, 156645, 156656, 1566591, 156902, 156905, 156150, 156245, 156289, 156500, 428156, 428163, 428167, 428209, 428901, B44C 122, C23F 100

Patent

active

053342798

ABSTRACT:
A new and improved printed circuit board tool and method of making and using it, to produce three dimensional printed circuit boards having grooves with strongly bonded or laminated metallic pads therein. The printed circuit board tool includes a metallized male mold substrate having a plurality of groove forming projections disposed in the substrate surface. The method of making the metallized mold includes forming a female parent or predecessor master tool that may be used to produce a large number of the metallized male molds for producing new and improved three-dimensional printed circuit boards. The new and improved three-dimensional printed circuit board includes a substrate composed of a high heat deflective plastic, and a plurality of recesses or grooves molded into the substrate surface for receiving therein the fine pitch, closely spaced-apart leads of an integrated circuit. A plurality of metallized sunken pads or lands are adhered or bonded within the grooves for establishing an electrical path within each groove.

REFERENCES:
patent: 3201238 (1965-08-01), Dwyer
patent: 3209066 (1965-09-01), Toomey et al.
patent: 3303254 (1967-02-01), Simons
patent: 4059479 (1977-11-01), Tanazawa
patent: 4944908 (1970-07-01), Leveque et al.
patent: 4969257 (1990-11-01), Sato et al.
patent: 5168624 (1992-12-01), Shirai

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