Method and apparatus for making electrical contact to a substrat

Details Method and apparatus for making electrical contact to a substrat Method and apparatus for making electrical contact to a substrat

1998-10-28

2000-06-20

Gorgos, Kathryn

Chemistry: electrical and wave energy

Apparatus

Electrolytic

204286, C25D 1704

Patent

active

060774053

ABSTRACT:
A method and apparatus for electroplating a film onto a substrate. Electrical power is supplied to the plating surface through electrical contact made to contact pads on the underside of the substrate. Contact to the contact pads is made within a liquid-tight region. The contact pads are connected to the plating surface through the substrate. Because the contact scheme is provided within a liquid-tight region on the underside of the substrate, the contacts do not erode or become plated, nor do they consume an area of the plating surface.

REFERENCES:
patent: 5516416 (1996-05-01), Canaperi
patent: 5935404 (1999-08-01), Farooq et al.

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