Method and apparatus for magnetron discharge type sputtering

Details Method and apparatus for magnetron discharge type sputtering Method and apparatus for magnetron discharge type sputtering

1989-10-11

1991-09-10

Weisstuch, Aaron

Chemistry: electrical and wave energy

Processes and products

Coating, forming or etching by sputtering

2042982, C23C 1435

Patent

active

050471309

ABSTRACT:
Magnetron discharge type sputtering apparatus for sputtering a target with plasma. The apparatus comprises a flat target, a magnetic field application unit disposed in the vicinity of the back surface of said target and rotating means for rotating a magnetic field provided on the surface of the target by said magnetic field application unit. The magnetic field application unit is constructed such that erosion produced in the target by the sputtering tends to be deeper at an edge portion of an erosion area than at a central portion thereof. Further, there is disclosed a method of magnetron plasma discharge type sputtering of a flat target, wherein erosion produced in the target by the sputtering tends to be deeper at an edge portion of the target than at a central portion thereof.

REFERENCES:
patent: 4746417 (1988-05-01), Ferenbach et al.

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