Method and apparatus for machining semiconductor material

Details Method and apparatus for machining semiconductor material Method and apparatus for machining semiconductor material

1996-10-21

1998-04-21

Rose, Robert A.

Abrading

Abrading process

With tool treating or forming

451444, 125 1301, B24B 53007

Patent

active

057411735

ABSTRACT:
A method and an apparatus are for machining semiconductor material with a inding tool while feeding a liquid cleaning agent to the working surface of the grinding tool, has the cleaning agent being exposed to sound waves having a specific frequency and having a specific intensity. In one embodiment of the method, the cleaning agent is exposed to sound waves in at least one nozzle and then the cleaning agent is directed against the working surface of the grinding tool. In another embodiment, the cleaning agent is guided through at least two cleaning agent jets against the working surface of the grinding tool, which cleaning agent jets differ from each other in that they are exposed to sound waves of different frequencies.

REFERENCES:
patent: 3123951 (1964-03-01), Kuris et al.
patent: 4498345 (1985-02-01), Dyer et al.
patent: 4844047 (1989-07-01), Brehm et al.
Patent Abstracts of Japan, vol. 95, No. 010 & JP 07283183 A.
Patent Abstracts of Japan, vol. 014, No. 564 (E-1013), 14, Dec. 1990.
Patent Abstracts of Japan, vol. 014, No. 099 (E-0893), 22, Feb. 1990.

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