Method and apparatus for lowering the die temperature of a...

Electrical computers and digital data processing systems: input/ – Interrupt processing

Reexamination Certificate

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C713S320000, C713S324000, C710S267000

Reexamination Certificate

active

09669034

ABSTRACT:
According to one embodiment, a method is disclosed. The method includes determining whether the temperature of a central processing unit (CPU) exceeds a predetermined threshold. In addition, the method includes generating a first interrupt if the temperature of the CPU exceeds the predetermined threshold and transitioning from a first execution mode to a second execution mode.

REFERENCES:
patent: 4432031 (1984-02-01), Premerlani
patent: 4442972 (1984-04-01), Sahay et al.
patent: 4488824 (1984-12-01), Salem
patent: 4591855 (1986-05-01), Blackburn
patent: 4751405 (1988-06-01), Bufano, Jr. et al.
patent: 4779161 (1988-10-01), DeShazo, Jr.
patent: 4787007 (1988-11-01), Matsumura et al.
patent: H562 (1988-12-01), Trachier et al.
patent: 4789819 (1988-12-01), Nelson
patent: 4799176 (1989-01-01), Cacciatore
patent: 4807144 (1989-02-01), Joehlin et al.
patent: RE32960 (1989-06-01), Levine
patent: 4851987 (1989-07-01), Day
patent: 4903106 (1990-02-01), Fukunaga et al.
patent: 4924112 (1990-05-01), Anderson et al.
patent: 4935864 (1990-06-01), Schmidt et al.
patent: 5008771 (1991-04-01), Palara
patent: 5025248 (1991-06-01), Bergeron
patent: 5064296 (1991-11-01), Huijsing et al.
patent: 5077491 (1991-12-01), Heck et al.
patent: 5085526 (1992-02-01), Sawtell et al.
patent: 5087870 (1992-02-01), Salesky et al.
patent: 5105366 (1992-04-01), Beckey
patent: 5125093 (1992-06-01), McFarland
patent: 5149199 (1992-09-01), Kinoshita et al.
patent: 5170344 (1992-12-01), Berton et al.
patent: 5253938 (1993-10-01), Stixrud
patent: 5255149 (1993-10-01), Matsuo
patent: 5283631 (1994-02-01), Koerner et al.
patent: 5287292 (1994-02-01), Kenny et al.
patent: 5291607 (1994-03-01), Ristic et al.
patent: 5325286 (1994-06-01), Weng et al.
patent: 5359236 (1994-10-01), Giordano et al.
patent: RE34789 (1994-11-01), Fraden
patent: 5420808 (1995-05-01), Alexander et al.
patent: 5422832 (1995-06-01), Moyal
patent: 5440305 (1995-08-01), Signore et al.
patent: 5451892 (1995-09-01), Bailey
patent: 5453682 (1995-09-01), Hinrichs et al.
patent: 5490059 (1996-02-01), Mahalingaiah et al.
patent: 5560017 (1996-09-01), Barrett et al.
patent: 5625311 (1997-04-01), Nakatsu
patent: 5664201 (1997-09-01), Ikedea
patent: 5719800 (1998-02-01), Mittal et al.
patent: 5752001 (1998-05-01), Dulong
patent: 5805907 (1998-09-01), Loper et al.
patent: 5838578 (1998-11-01), Pippin
patent: 5870616 (1999-02-01), Loper et al.
patent: 5948105 (1999-09-01), Skurnik et al.
patent: 5978864 (1999-11-01), Hetherington et al.
patent: 5996084 (1999-11-01), Watts
patent: 6006168 (1999-12-01), Schumann et al.
patent: 6112164 (2000-08-01), Hobson
patent: 6138232 (2000-10-01), Shiell et al.
patent: 6219795 (2001-04-01), Klein
patent: 6789037 (2004-09-01), Gunther et al.
patent: 0075498 (1983-03-01), None
patent: 0 566 395 (1993-04-01), None
patent: 0551090 (1993-07-01), None
patent: 0566395 (1993-10-01), None
patent: 0 683 558 (1995-05-01), None
patent: 0683558 (1995-11-01), None
patent: 0851336 (1998-07-01), None
patent: 0926596 (1999-06-01), None
International Search Report, PCT/US01/29603, Feb. 12, 2002.
Salminen et al., “The Higher Order Temperature Compensation of Bandgap Voltage References,” 1992 IEEE, Helsinki University of Technology, pp. 1388-1391.
Allen et al., “CMOS Analog Circuit Design,” HRW, 1987, pp. 520-551.
Chin et al., “A New Type of Curvature-Compensated CMOS Bandgap Voltage References,” IEEE, 1991, pp. 398-402.
Ferro et al., “A Floating CMOS Bandgap Voltage Reference for Differential Applications,” IEEE, 1992, pp. 690-697.

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