Method and apparatus for low temperature copper to copper...

Details Method and apparatus for low temperature copper to copper... Method and apparatus for low temperature copper to copper...

2007-02-27

2007-02-27

Clark, Jasmine (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Bump leads

C257S777000, C257S737000, C257SE23021, C257SE23069, C257SE21508, C228S180220

Reexamination Certificate

active

10861030

ABSTRACT:
A method comprising: coating a conductive bump on a first substrate with a conductive material to form a coated conductive bump; coating a conductive bump on a second substrate with a conductive material to form a coated conductive bump; and bonding the coated conductive bump on the first substrate to the coated conductive bump on the second substrate to electrically connect the first substrate to the second substrate.

REFERENCES:
patent: 6127253 (2000-10-01), Roldan et al.
patent: 6177729 (2001-01-01), Benenati et al.
patent: 6495397 (2002-12-01), Kubota et al.
patent: 2002/0070463 (2002-06-01), Chang et al.
patent: 2003/0063452 (2003-04-01), Satonaka

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