Chemistry: electrical and wave energy – Processes and products – Coating – forming or etching by sputtering
Patent
1992-10-01
1994-03-29
Nguyen, Nam
Chemistry: electrical and wave energy
Processes and products
Coating, forming or etching by sputtering
20429806, 20429809, 20429816, 20429822, C23C 1434
Patent
active
052981371
ABSTRACT:
An emission enhanced sputtering magnetron apparatus includes an elongated rod or bar like cathode jacketed by a target material. An electron emission enhancement device positioned around the end of the elongated cathode creates a thin, highly uniform plasma sheath along the remainder of the cathode, thereby enhancing the sputtering rate along the entire length of the cathode target material. A low voltage, high current AC or DC magnet supply connected across the elongated cathode generates a plasma-confining magnetic field circumferentially around the entire length of the cathode. In an alternate embodiment, a single elongated tube or bar of the target material can be conformed into the cathode, the electron emission enhancing device, and a working end portion that can be formed into nearly any shape to conform to the shape of the surface being coated with the target material.
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Nguyen Nam
Surface Solutions, Inc.
Young James R.
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