Method and apparatus for laying out power supply wiring

Details Method and apparatus for laying out power supply wiring Method and apparatus for laying out power supply wiring

2005-02-08

2005-02-08

Do, Thuan (Department: 2825)

Computer-aided design and analysis of circuits and semiconductor

Nanotechnology related integrated circuit design

C716S030000, C716S030000, C716S030000, C716S030000

Reexamination Certificate

active

06854094

ABSTRACT:
A method for designing power supply wiring of a semiconductor integrated circuit having a logic circuit. A first power consumption value of the logic circuit is calculated based on logic connection information, and the power supply wiring is laid out in accordance with the first power consumption value. Logic modification connection information relating to the modified logic circuit is generated when the logic circuit is modified after the power supply wiring is laid out. A second power consumption value of the modified logic circuit is calculated based on the logic modification connection information. When the second power consumption value exceeds the first power consumption value, it is determined that the power supply wiring must be re-laid out. It is thus easily determined whether to re-lay out the power supply wiring without performing power supply network analysis.

REFERENCES:
patent: 6421816 (2002-07-01), Ishikura
patent: 6493863 (2002-12-01), Hamada et al.
patent: 11-274311 (1999-10-01), None
patent: 2000-020576 (2000-01-01), None
patent: 2000-148833 (2000-05-01), None
patent: 2000-349161 (2000-12-01), None

Affiliated with

Also associated with

Rating

Method and apparatus for laying out power supply wiring does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method and apparatus for laying out power supply wiring, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for laying out power supply wiring will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3447058