Method and apparatus for layer depositions

Details Method and apparatus for layer depositions Method and apparatus for layer depositions

1995-12-05

1997-11-25

Nguyen, Nam

Chemistry: electrical and wave energy

Processes and products

Coating, forming or etching by sputtering

20419212, 20419213, 2041923, 20419238, 20429803, 20429807, 20429811, 20429823, 20429826, 20429827, 20429828, 20429841, C23C 1434

Patent

active

056907966

ABSTRACT:
It is suggested for depositing layers of mechanically resistant material, in particular on highly stressed tools, to coat the workpieces (7) alternatingly by means of reactive cathode sputtering (1, 13) and to after-treat them by means of a further plasma discharge (3).

REFERENCES:
patent: 4346123 (1982-08-01), Kaufmann
patent: 4851095 (1989-07-01), Scobey et al.
patent: 4877505 (1989-10-01), Bergmann
patent: 4895631 (1990-01-01), Wirz et al.
patent: 4911784 (1990-03-01), Hensel et al.
patent: 5192578 (1993-03-01), Ramm et al.
Internat. Search Report for PCT/CH93/00291.

Affiliated with

Also associated with

Rating

Method and apparatus for layer depositions does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method and apparatus for layer depositions, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for layer depositions will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2103604