Method and apparatus for inspection and correction of wiring of

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified configuration

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257 57, 257 59, 257 72, 257529, H01L 2348, H01L 2952, H01L 2940

Patent

active

058834370

ABSTRACT:
A method and apparatus for inspecting wirings of an electronic circuit substrate to detect a defect in the wiring and for enabling correction thereof. The inspection method and apparatus include electrostatically coupling at least one electrode to a wiring pattern, applying a time varying voltage between the electrode and wiring pattern at different locations so as to detect a current flow and determine a defect by a variation in the detected current flow at the different locations and a portion of the defect. A defect in the form of a disconnected or half-disconnected point of the wiring may be corrected by supplying a solution of a metal complex to the disconnected or half-disconnected point, heating the solution and end point areas of the disconnected or half-disconnected point by laser light and precipitating a metal thin film establishing a connection of the wiring.

REFERENCES:
patent: 4874719 (1989-10-01), Kurosawa
patent: 5138266 (1992-08-01), Stearns
patent: 5164565 (1992-11-01), Addiego et al.
patent: 5327011 (1994-07-01), Iwamatsu
patent: 5389814 (1995-02-01), Srikrishnan et al.

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