Method and apparatus for inspecting defect of pattern formed...

Details Method and apparatus for inspecting defect of pattern formed... Method and apparatus for inspecting defect of pattern formed...

2009-01-08

2011-10-25

Lee, Hwa (Department: 2886)

Image analysis

Applications

Manufacturing or product inspection

Reexamination Certificate

active

08045789

ABSTRACT:
In the inspection apparatus for a defect of a semiconductor and the method using it for automatically detecting the defect on a semiconductor wafer and presuming the defect occurrence factor using the circuit design data, a plurality of shapes are formed from the circuit design data by deforming the design data with respect to shape deformation items stipulated for respective defect occurrence factor for comparison with the inspection object circuit pattern. The defect is detected by comparison of the group of shapes formed and the actual pattern. Further, the occurrence factors of these defects are presumed, and the defects are classified according to respective factor.

REFERENCES:
patent: 7925095 (2011-04-01), Sugiyama et al.
patent: 2000-030652 (2000-01-01), None
patent: 2005-277395 (2005-10-01), None

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