Method and apparatus for inspecting a solder joint using a corre

Details Method and apparatus for inspecting a solder joint using a corre Method and apparatus for inspecting a solder joint using a corre

1997-04-07

2000-02-08

Wachsman, Hal

Data processing: measuring, calibrating, or testing

Measurement system in a specific environment

Quality evaluation

702 40, 706 20, 706 25, 706 40, 382150, G06F 1700

Patent

active

060236639

ABSTRACT:
A solder joint inspection process and system includes using a correlation values to classify the shape of the solder joint. The solder joint is illuminated by a multiple colors, and the image of the solder joint is captured. This multiple color image is then converted into a plurality of one-dimensional vectors. Each one-dimensional vectors sequence is for one color of the multi-color illumination and for a one-dimensional spatial extent. Correlation values among all combinations of the one-dimensional vector sequences are computed and used for training an automatic solder joint shape classifier.

REFERENCES:
patent: 5245671 (1993-09-01), Kobayashi et al.
patent: 5548697 (1996-08-01), Zortea
patent: 5598345 (1997-01-01), Tokura
patent: 5751910 (1998-05-01), Bryant et al.
patent: 5787408 (1998-07-01), Deangelis

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