Method and apparatus for increasing uniformity in ion mill...

Details Method and apparatus for increasing uniformity in ion mill... Method and apparatus for increasing uniformity in ion mill...

2005-03-01

2010-12-07

McDonald, Rodney G (Department: 1795)

Chemistry: electrical and wave energy

Processes and products

Coating, forming or etching by sputtering

C204S192320, C204S298320, C204S298360

Reexamination Certificate

active

07846305

ABSTRACT:
A method for increasing etch depth uniformity in ion milling process in a wafer manufacturing process encompasses loading designated regions of a production pallet with carriers containing wafers to be ion milled. These designated regions have been predetermined to exhibit similar and preferred depths of etching. Non-designated regions of the production pallet are then loaded with dummy carriers and the wafers are ion milled.

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