Chemistry: electrical and wave energy – Processes and products – Coating – forming or etching by sputtering
Reexamination Certificate
2005-03-01
2010-12-07
McDonald, Rodney G (Department: 1795)
Chemistry: electrical and wave energy
Processes and products
Coating, forming or etching by sputtering
C204S192320, C204S298320, C204S298360
Reexamination Certificate
active
07846305
ABSTRACT:
A method for increasing etch depth uniformity in ion milling process in a wafer manufacturing process encompasses loading designated regions of a production pallet with carriers containing wafers to be ion milled. These designated regions have been predetermined to exhibit similar and preferred depths of etching. Non-designated regions of the production pallet are then loaded with dummy carriers and the wafers are ion milled.
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Camacho Omar Eduardo Montero
Chen Pei Cheh
Samuelson Laurence Scott
Sun Yongjian
Hitachi Global Storage Technologies - Netherlands B.V.
McDonald Rodney G
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