Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1992-04-15
1996-11-26
Pal, Asok
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
1566271, 1566451, 1566431, H01L 21302
Patent
active
055781616
ABSTRACT:
An apparatus (20) for monitoring the trench formation process in a silicon wafer on a full in-situ and on-line basis. The apparatus includes two spectrometers (30A, 30B) for viewing the plasma used in the trench etching process at zero and normal angles of incidence with respect to the plane of the wafer, respectively. Both spectrometers are tuned to detect the radiation associated with a selected specie present in the plasma. Based on information contained in the output signals of the spectrometers, the depth D of the trench and the thickness Th and rate of deposition of the redeposited SiO.sub.2 layer are computed in real time. When the computed depth D matches a final depth of parameter, the trench formation process is terminated.
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International Business Machines - Corporation
Meier Lawrence H.
Pal Asok
Shkurko Eugene I.
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