Method and apparatus for improving film deposition uniformity on

Details Method and apparatus for improving film deposition uniformity on Method and apparatus for improving film deposition uniformity on

1997-05-13

2000-02-08

Meeks, Timothy

Coating processes

Coating by vapor, gas, or smoke

42725527, 42725528, 427255391, 427255395, 4272554, 4272557, C23C 1642

Patent

active

060225874

ABSTRACT:
A method and apparatus for depositing a film on a substrate. According to the present invention a prewafer reaction layer is deposited onto a susceptor placed in the reaction chamber to form a prewafer reaction layer coated susceptor prior to film deposition. A deposition gas is then fed into the reaction chamber so that it flows over the prewafer reaction layer coated susceptor and the substrate to form a film on the prewafer reaction layer coated susceptor and the substrate.

REFERENCES:
patent: 4619038 (1986-10-01), Pintchovski
patent: 4650698 (1987-03-01), Moriya et al.
patent: 4668530 (1987-05-01), Reif et al.
patent: 4923715 (1990-05-01), Matsuda et al.
patent: 5091219 (1992-02-01), Monowski et a.
patent: 5421957 (1995-06-01), Carlson et al.
Pierson, Handbook of Chemical Vapor Deposition, Noyes Publications, Park Ridge, New Jersey, pp. 246-247 (no month), 1992.

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