Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Ball or nail head type contact – lead – or bond
Reexamination Certificate
2007-02-20
2007-02-20
Whitehead, Jr., Carl (Department: 2813)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Ball or nail head type contact, lead, or bond
C257S757000, C257S758000, C257S772000, C257S778000, C257S779000, C438S612000, C438S613000, C438S622000, C438S623000
Reexamination Certificate
active
10739726
ABSTRACT:
An apparatus comprising: a die having a top metal layer, the top metal layer comprised of at least a first metal line and a second metal line; a passivation layer covering the top metal layer; a C4 bump on the passivation layer; and a first passivation opening and a second passivation opening in the passivation layer, the first passivation opening to connect the first metal line to the C4 bump, and the second passivation opening to connect the second metal line to the C4 bump.
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Bohr Mark T.
Martell Robert W.
Intel Corporation
Jr. Carl Whitehead
Mitchell James M.
Wheeler Cyndi M.
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