Method and apparatus for implanting semiconductor wafer...

Radiant energy – Irradiation of objects or material – Irradiation of semiconductor devices

Reexamination Certificate

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C250S492200, C118S730000

Reexamination Certificate

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07053386

ABSTRACT:
A gripper for loading wafers onto an implant wheel W and removing them from the wheel. The gripper having a substrate engaging mechanism (14) for engaging the substrate and a means for rotating this substrate engaging mechanism, such that wafers can be removed from the implant wheel, rotated to a second orientation and replaced without leaving the process chamber.

REFERENCES:
patent: 4733087 (1988-03-01), Narita et al.
patent: 5389793 (1995-02-01), Aitken et al.
patent: 5456561 (1995-10-01), Poduje et al.
patent: 5641969 (1997-06-01), Cooke et al.
patent: 5989342 (1999-11-01), Ikeda et al.
patent: 0 163 413 (1985-12-01), None
patent: 2 191 335 (1987-12-01), None
patent: 61-142752 (1986-06-01), None
patent: 61-269843 (1986-11-01), None
patent: 62-5549 (1987-01-01), None
patent: 63-218140 (1988-09-01), None
patent: 2-189850 (1990-07-01), None
patent: 3-226953 (1991-10-01), None
patent: 97/45861 (1997-12-01), None

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