Method and apparatus for imaging surface topography of a wafer

Details Method and apparatus for imaging surface topography of a wafer Method and apparatus for imaging surface topography of a wafer

1997-10-28

1999-09-14

Font, Frank G.

Optics: measuring and testing

Inspection of flaws or impurities

Having predetermined light transmission regions

356135, 356385, G01N 2100

Patent

active

059531150

ABSTRACT:
A method for imaging surface topography is based on Total Internal Reflection (TIR) and is particularly useful for imaging surface topography of wafers used in the manufacture of integrated circuits. This surface topography includes scratches, which are more localized, and dishing, which is a gentle dip over a larger area. In practice, a wafer is placed with the surface of interest in close contact with a prism or other internal reflection element (IRE). Light of suitable wavelength is incident at a suitable incident angle through the IRE of suitable refractive index in order to allow total internal reflectance at the surface of the IRE in close contact with the wafer surface. The reflected beam is then imaged to give a map of the location and dimensions, and some information on the depth, of the various surface features on the wafer.

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patent: 5280334 (1994-01-01), Gisin et al.
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