Method and apparatus for high electrical and thermal...

Details Method and apparatus for high electrical and thermal... Method and apparatus for high electrical and thermal...

2005-09-27

2005-09-27

Ngô, Ngân V. (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

C257S697000, C257S706000, C257S717000, C257S724000

Reexamination Certificate

active

06949823

ABSTRACT:
A high electrical and thermal performance thick film ceramic ball grid array package with a laser cut die cavity is presented. The thick film ceramic ball grid array package may have a thick film ceramic substrate with a first side and a second side with a heat spreader or a heat sink on the second side. An IC die may be attached to the heat spreader or heat sink through the laser cut die cavity and wire bonded to pads on the first side of the ceramic substrate. The thick film ceramic substrate may have one or more integrated passive components.

REFERENCES:
patent: 6108212 (2000-08-01), Lach et al.
patent: 6132543 (2000-10-01), Mohri et al.
patent: 2001/0046725 (2001-11-01), Ho
patent: 2003/0096447 (2003-05-01), Lao et al.
patent: 2003/0164556 (2003-09-01), Jiang et al.
patent: 2005/0023677 (2005-02-01), Zhao et al.
patent: 2005/0035452 (2005-02-01), Zhang et al.

Affiliated with

Also associated with

Rating

Method and apparatus for high electrical and thermal... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method and apparatus for high electrical and thermal..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for high electrical and thermal... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3394091