4. Metal fusion bonding
  5. Process
  6. Plural joints

Andrew Grieder

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High temperature eutectic solder ball attach

Metal fusion bonding – Process – Plural joints
Reexamination Certificate

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Method and apparatus for high electrical and thermal...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2794596

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