Method and apparatus for heating polishing pad

Details Method and apparatus for heating polishing pad Method and apparatus for heating polishing pad

2005-05-24

2005-05-24

Nguyen, Dung Van (Department: 3723)

Abrading

Precision device or process - or with condition responsive...

Controlling temperature

C451S008000, C451S053000

Reexamination Certificate

active

06896586

ABSTRACT:
A temperature controlling system for use in a chemical mechanical planarization (CMP) system having a linear polishing belt, a carrier capable of applying a substrate over a preparation location over the linear polishing belt is provided. The temperature controlling system includes a platen having a plurality of zones. The temperature controlling system further includes a temperature sensor configured determine a temperature of the linear polishing belt at a location that is after the preparation location. The system also includes a controller for adjusting a flow of temperature conditioned fluid to selected zones of the plurality of zones of the platen in response to output received from the temperature sensor.

REFERENCES:
patent: 5873769 (1999-02-01), Chiou et al.
patent: 6000997 (1999-12-01), Kao et al.
patent: 6224461 (2001-05-01), Boehm et al.
patent: 6352470 (2002-03-01), Elledge
patent: 6533647 (2003-03-01), Brunelli
patent: 6544111 (2003-04-01), Kimura et al.
patent: 20030045205 (2003-03-01), Herb et al.

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