Method and apparatus for handling semiconductor wafers

Material or article handling – Apparatus for charging a load holding or supporting element... – Load holding or supporting element including gripping means

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294113, 414786, B65H 162, B65H 500

Patent

active

050469096

ABSTRACT:
A method and apparatus is disclosed for handling semiconductor wafers used for the production of integrated circuit structures which permits moving the wafer from one processing station to another without direct handling of the wafer and which also permits equal processing of both the top and bottom surfaces of the wafer. A wafer retaining ring is disclosed having structure for engaging the retaining ring to transfer the wafer and the retaining ring from one processing station to another to perform a plurality of processing steps on one or both surfaces of the wafer without direct handling of the wafer. The retaining ring is also provided with structure for engaging the end edges of the wafer leaving both the top and bottom surfaces of the wafer equally exposed for processing. The retaining ring has an inner diameter sufficiently large with respect to the outer diameter of the wafer so as to not interfere with processing by shadowing either side of the wafer.

REFERENCES:
patent: 4306731 (1981-12-01), Shaw
patent: 4473455 (1984-09-01), Dean et al.
patent: 4529353 (1985-07-01), Dean et al.
patent: 4584045 (1986-04-01), Richards
patent: 4779877 (1988-10-01), Shaw

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