Method and apparatus for grinding notches of semiconductor wafer

Details Method and apparatus for grinding notches of semiconductor wafer Method and apparatus for grinding notches of semiconductor wafer

1991-07-12

1993-02-16

Rachuba, M.

Abrasive tool making process, material, or composition

Impregnating or coating an abrasive tool

51 48R, 51 50R, 511658, B24B 906

Patent

active

051859653

ABSTRACT:
A method of grinding the notch of a thin workpiece, for example, a semiconductor wafer in the circumferential direction and the thickness direction by arranging a rotating disk-form grinding wheel and a semiconductor wafer to be ground with said wheel in such positions that the respective planes orthogonally cross with each other, moving said wheel in an axial direction of the spindle or rotating said semiconductor wafer upon the center thereof, moving said semiconductor wafer in a direction of approach to or alienation from said wheel, and moving said wheel in a direction to cross orthogonally with said axial line direction and direction of approach to or alienation from said wheel, and an apparatus therefor.

REFERENCES:
patent: 3809050 (1974-05-01), Chough et al.
patent: 4864779 (1989-09-01), Ozaki
patent: 4905425 (1990-03-01), Sekigawa et al.

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