Method and apparatus for global die thinning and polishing...

Details Method and apparatus for global die thinning and polishing... Method and apparatus for global die thinning and polishing...

2005-09-06

2005-09-06

Hail, III, Joseph J. (Department: 3723)

Abrading

Abrading process

Combined abrading

C451S005000, C451S006000, C451S008000, C451S009000, C451S010000, C451S011000, C451S041000, C451S285000, C451S286000, C451S287000, C451S288000, C451S403000

Reexamination Certificate

active

06939209

ABSTRACT:
A reliable, inexpensive “back side” thinning process and apparatus therefor, capable of globally thinning an integrated circuit die to a target thickness of 10 microns, and maintaining a yield of at least 80%, for chip repair and/or failure analysis of the packaged die. The flip-chip packaged die is exposed at its backside and mounted on a lapping machine with the backside exposed. The thickness of the die is measured at at least five locations on the die. The lapping machine grinds the exposed surface of the die to a thickness somewhat greater than the target thickness. The exposed surface of the die is polished. The thickness of the die is again measured optically with high accuracy. Based on the thickness data collected, appropriate machine operating parameters for further grinding and polishing of the exposed surface are determined. Further grinding and polishing are performed. These steps are repeated until the target thickness is reached.

REFERENCES:
patent: 5698474 (1997-12-01), Hurley
patent: 5827779 (1998-10-01), Masumura et al.
patent: 6252239 (2001-06-01), Goruganthu et al.
patent: 6281027 (2001-08-01), Wei et al.
patent: 6448801 (2002-09-01), Dischiano
patent: 6583873 (2003-06-01), Goncharov et al.

Affiliated with

Also associated with

Rating

Method and apparatus for global die thinning and polishing... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method and apparatus for global die thinning and polishing..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for global die thinning and polishing... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3391597