Computer-aided design and analysis of circuits and semiconductor – Nanotechnology related integrated circuit design
Reexamination Certificate
2005-10-18
2008-10-21
Dinh, Paul (Department: 2825)
Computer-aided design and analysis of circuits and semiconductor
Nanotechnology related integrated circuit design
Reexamination Certificate
active
07441221
ABSTRACT:
An apparatus generates design information on a via hole that passes through predetermined layers of a multilayer wiring board, by storing information on at least one of a shape and a size of a land to be provided around the via hole. When designing a via hole that passes through a plurality of internal layers of the wiring board, the land information for an internal layer is applied to each internal layer through which the via hole passes.
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Kinji Ito, “Prinited Wiring Technical Reader”, p. 193, 2NDEdition, Published by the Nikkan Kogyo Shimbun Co., Ltd, May 1989.
Kawamichi Taketsugu
Konno Eiichi
Nakamura Hiroshi
Dinh Paul
Fujitsu Limited
Staas & Halsey , LLP
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