Method and apparatus for generating a wafer map

Details Method and apparatus for generating a wafer map Method and apparatus for generating a wafer map

2007-07-10

2007-07-10

Lin, Sun James (Department: 2825)

Computer-aided design and analysis of circuits and semiconductor

Nanotechnology related integrated circuit design

C716S030000

Reexamination Certificate

active

10896190

ABSTRACT:
A system is provided to aid in laying out circuits on a semiconductor wafer, in which a wafer map is automatically generated when entering chip sizes, arrangements and other enterable factors, with a goal to maximize yield probability. The subject system accommodates different chip types and arrangements within a wafer map and addresses edge exclusion, utilization of chiplets and accommodation of different centering techniques, including a variety of ways of measuring offsets, while outputting a display of replicated circuits on the wafer as well as chip count and density, utilizing a portable, tailorable, extendable PC-based program featuring an easy-to-use graphical interface. The software application provides a user with different graphical views customized for different process areas, such as lithography and dicing, with the application being useful for any semiconductor manufacturing facility, foundry or similar industry that needs to generate wafer maps automatically to maximize yield probability.

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patent: 6714885 (2004-03-01), Lee

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