Computer-aided design and analysis of circuits and semiconductor – Nanotechnology related integrated circuit design
Reexamination Certificate
2007-03-20
2007-03-20
Do, Thuan V. (Department: 2825)
Computer-aided design and analysis of circuits and semiconductor
Nanotechnology related integrated circuit design
C716S030000
Reexamination Certificate
active
10979957
ABSTRACT:
A method and apparatus for full-chip thermal analysis of semiconductor chip designs is provided. One embodiment of a novel method for performing thermal analysis of a semiconductor chip design comprises receiving at least one input relating to a semiconductor chip design to be analyzed. The input is then processed to produce a three-dimensional thermal model of the semiconductor chip design. In another embodiment, thermal analysis of the semiconductor chip design is performed by calculating power dissipated by transistors and interconnects included in the semiconductor chip design and distributing power dissipated by the interconnects.
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Do Thuan V.
Gradient Design Automation Inc.
Patterson & Sheridan LLP
Tat Binh
Tong, Esq. Kin-Wah
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