Method and apparatus for forming stacked die and substrate...

Details Method and apparatus for forming stacked die and substrate... Method and apparatus for forming stacked die and substrate...

2007-04-27

2009-11-03

Potter, Roy K (Department: 2822)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

C438S122000, C257SE23101

Reexamination Certificate

active

07611923

ABSTRACT:
A stacked semiconductor apparatus has at least one die attached to a first side of a carrier substrate. A first circuitized substrate is attached to the first side of the carrier substrate and overlying the at least one die in a manner such that the first circuitized substrate serves as an electrical interconnection device and a heat spreading lid. The first circuitized substrate is further configured so as to facilitate cooling of the at least one die by at least a cross flow of a cooling medium therethrough.

REFERENCES:
patent: 6101100 (2000-08-01), Londa
patent: 6172874 (2001-01-01), Bartilson
patent: 6255136 (2001-07-01), Alcoe et al.
patent: 6373133 (2002-04-01), DiGiacomo
patent: 6392298 (2002-05-01), Leighton
patent: 6611057 (2003-08-01), Mikubo
patent: 6627980 (2003-09-01), Eldridge
patent: 6724079 (2004-04-01), Viswanathan et al.
patent: 6858926 (2005-02-01), Moden
patent: 2002/0074637 (2002-06-01), McFarland
patent: 2003/0020173 (2003-01-01), Huff
patent: 2004/0016939 (2004-01-01), Akiba
patent: 2004/0041256 (2004-03-01), Takehara
INTEL, [online]; [ retrieved on Feb. 14, 2005]; retrieved from the Internet http://www.intel.com/research/silicon/mobilepackaging.htm, “Silicon Research Areas” 4p.

Affiliated with

Also associated with

Rating

Method and apparatus for forming stacked die and substrate... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method and apparatus for forming stacked die and substrate..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for forming stacked die and substrate... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4087392