Method and apparatus for forming stacked die and substrate...

Details Method and apparatus for forming stacked die and substrate... Method and apparatus for forming stacked die and substrate...

2007-07-31

2007-07-31

Potter, Roy (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

For plural devices

C257S712000

Reexamination Certificate

active

10908277

ABSTRACT:
A stacked semiconductor apparatus has at least one die attached to a first side of a carrier substrate. A first circuitized substrate is attached to the first side of the carrier substrate and overlying the at least one die in a manner such that the first circuitized substrate serves as an electrical interconnection device and a heat spreading lid. The first circuitized substrate is further configured so as to facilitate cooling of the at least one die by at least a cross flow of a cooling medium therethrough.

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Silicon, [online]; [retrieved on Feb. 14, 2005]; retrieved from the Internet http://www.intel.com/research/silicon/mobilepackaging.htm.

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