Method and apparatus for forming solder on a substrate

Details Method and apparatus for forming solder on a substrate Method and apparatus for forming solder on a substrate

1997-12-18

1999-06-01

Picardat, Kevin M.

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

438613, 438615, 438127, H01L 2144

Patent

active

059096349

ABSTRACT:
The invention discloses a method for forming solder (114) on a substrate (112). The method includes forming a decal (110) with a plurality of solder regions (113). The method further comprises aligning the decal (110) with the substrate (112) and transferring the solder regions (113) on the decal (110) to the substrate (112).

REFERENCES:
patent: 5411897 (1995-05-01), Harvey et al.
patent: 5658827 (1997-08-01), Aulicino et al.
patent: 5672542 (1997-09-01), Schwiebert et al.
patent: 5723369 (1998-03-01), Barber

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