Method and apparatus for forming expitaxial layers

Semiconductor device manufacturing: process – Making device or circuit emissive of nonelectrical signal – Mesa formation

Reexamination Certificate

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C438S044000, C438S222000, C438S226000, C438S413000, C438S442000, C257SE21090, C257SE21461

Reexamination Certificate

active

07615390

ABSTRACT:
The present invention provides a method of depositing epitaxial layers based on Group IV elements on a silicon substrate by Chemical Vapor Deposition, wherein nitrogen or one of the noble gases is used as a carrier gas, and the invention further provides a Chemical Vapor Deposition apparatus (10) comprising a chamber (12) having a gas input port (14) and a gas output port (16), and means (18) for mounting a silicon substrate within the chamber (12), said apparatus further including a gas source connected to the input port and arranged to provide nitrogen or a noble gas as a carrier gas.

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patent: 2003/0036268 (2003-02-01), Brabant et al.
patent: WO 01/14619 (2001-03-01), None
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Von Munch W et al: “New Susceptor Arrangement for the Epitaxial Growth of Beta-SiC on Silicon” Journal of Crystal Growth, North-Holland Publishing Co., Amsterdam, NL, vol. 158, No. 4, Feb. 1, 1996.
Nordell N et al: “Growth of SiC Using Hexamethyldisilane in a Hydrogen-Poor Ambient” Applied Physics Letters, American Inst. of Physics. New York, YS, vol. 64, No. 13, Mar. 28, 1994 pp. 1647-1649.
Kobayashi S et al: “Initial Growth Characteristics of Germanium on Silicon in LPCVD Using Germane Gas” Journal of Crystal Growth, North-Holland Publishing Co., Amsterdam, NL, NOL. 174, No. 1-4, Apr. 1, 1997.

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