Method and apparatus for forming crystallized semiconductor...

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – On insulating substrate or layer

Reexamination Certificate

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C438S166000

Reexamination Certificate

active

06987035

ABSTRACT:
A method for forming a crystallized semiconductor layer includes preparing a non-single-crystal semiconductor layer in which at least one crystal seed is formed, and irradiating with an energy ray the non-single-crystal semiconductor layer having the crystal seed formed therein to allow a crystal to laterally grow from the crystal seed in the non-single-crystal semiconductor layer, irradiation of the energy ray is carried out by positioning to at least a part of the crystal seed an area having a minimum intensity value of the energy ray, the energy ray having a confirmation that an area having a maximum intensity value of the energy ray is continuously reduced to the area having the minimum intensity value in an irradiated surface.

REFERENCES:
patent: 5824574 (1998-10-01), Yamazaki et al.
patent: 6316338 (2001-11-01), Jung
patent: 2003/0071312 (2003-04-01), Oana et al.
patent: 1 047 119 (2000-10-01), None
patent: 2001-127301 (2001-05-01), None
Mitsuru Nakata, et al., “A New Nucleation-Site-Control Excimer-Laser-Crystallization Method”, Jpn. J. Appl. Phys., vol., 40 (2001), Part 1, No. 5A, May 2001, pp. 3049-3054.
Chang-Ho Oh, et al., “Preparation of Position-Controlled Crystal-Silicon Island Arrays by Means of Excimer-Laser Annealing”, Jpn. J. Appl. Phys., vol., 37, (1998), Part 1, No. 10, Oct. 1998, pp. 5474-5479.

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