Coating processes – Coating by vapor – gas – or smoke – Organic coating applied by vapor – gas – or smoke
Patent
1996-01-08
1999-09-28
Bueker, Richard
Coating processes
Coating by vapor, gas, or smoke
Organic coating applied by vapor, gas, or smoke
427488, 118719, 118724, 118725, 118726, 118729, C23C 1600
Patent
active
059585102
ABSTRACT:
A method and apparatus are disclosed for forming thin polymer layers on semiconductor substrates. In one embodiment, the method and apparatus include the sublimation of stable dimer parylene material, the pyrolytic conversion of such gaseous dimer material into reactive monomers, and for the optional blending of the resulting gaseous parylene monomers with one or more polymerizable materials in gaseous form capable of copolymerizing with the parylene monomers to form a low dielectric constant polymerized parylene material. An apparatus is also disclosed which provides for the distribution of the polymerizable gases into the deposition chamber, for cooling the substrate down to a temperature at which the gases will condense to form a polymerized dielectric material, for heating the walls of the deposition chamber to inhibit formation and accumulation of polymerized residues thereon, and for recapturing unreacted monomeric vapors exiting the deposition chamber. An apparatus is further provided downstream of the deposition chamber to control both the flow rate or residence time of the reactive monomer in the deposition chamber as well as to control the pressure of the deposition chamber. Provision is further made for an electrical bias to permit the apparatus to function as a plasma etch chamber, for in situ plasma cleaning of the chamber between depositions, for enhancing cracking of polymerizable precursor material, for heating the walls of the chamber and for providing heat sufficient to prevent polymerization in the gas phase.
REFERENCES:
patent: 3895135 (1975-07-01), Hofer
patent: 4500562 (1985-02-01), Jahn
patent: 4556584 (1985-12-01), Sarkozy
patent: 4945856 (1990-08-01), Stewart
patent: 4951601 (1990-08-01), Maydan et al.
patent: 4986216 (1991-01-01), Ohmori
patent: 5079031 (1992-01-01), Yamazaki
patent: 5121706 (1992-06-01), Nichols
patent: 5268202 (1993-12-01), You
patent: 5270082 (1993-12-01), Lin
patent: 5355832 (1994-10-01), Loh
patent: 5424097 (1995-06-01), Olson et al.
patent: 5447570 (1995-09-01), Schmitz
patent: 5491112 (1996-02-01), Buchta
patent: 5522933 (1996-06-01), Geller
patent: 5534068 (1996-07-01), Beach et al.
patent: 5536317 (1996-07-01), Crain et al.
patent: 5536319 (1996-07-01), Wary
patent: 5536321 (1996-07-01), Olsen et al.
patent: 5536322 (1996-07-01), Wary et al.
patent: 5536892 (1996-07-01), Dolbier et al.
patent: 5538758 (1996-07-01), Beach et al.
patent: 5556473 (1996-09-01), Olson et al.
patent: 5582866 (1996-12-01), White
patent: 5709753 (1998-01-01), Olson et al.
Sharma, Journal of Polymer Science: Part A: Polymer chemistry, vol. 26, 2953-2971 (1988).
Yasuda, Plasma Polymerization, Academic Press, N.Y., .COPYRGT.1985, pp. 65-71.
Jeng, Shin-Puu, et al., "A Planarized Multilevel Interconnect Scheme with Embedded Low-Dielectric-Constant Polymers for Sub-Quarter-Micron Applications", Publication, J. Vac. Sci + Tech., Jun. 1995.
Olson, R., "Xylylene Polymers," Encyclopedia of Polymer Science and Engineering, 2nd ed., vol. 17, pp. 990-1025.
Parker, Sybil P., ed., McGraw-Hill Dictionary of Chemistry, New York: McGraw-Hill Book Co., 1984, p. 450.
Sax, N. Ivring, et al., Hawley's Condensed Chemical Dictionary, revised ed., New York: Van Nostrand Reinhold Co., 1987, p. 876.
Sharma, Ashok K., "Parylene C at Subambient Temperatures", Journal of Polymer Science: Part A. Polymer Chemistry, vol. 26, 1988, pp. 2953-2971.
Fong Gary L.
Lee Peter W.
Lim Vicente
Nguyen Bang C.
Rao Gayathri
Applied Materials Inc.
Bueker Richard
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