Method and apparatus for fluid delivery to a backside of a...

Fluid sprinkling – spraying – and diffusing – Distributor continuously moves relative to support during...

Reexamination Certificate

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Details

C239S222000, C239S504000, C239S548000, C134S144000, C134S902000

Reexamination Certificate

active

07128279

ABSTRACT:
A fluid delivery device for delivering fluid to the backside of a substrate while minimizing waste is provided. The device includes an inner cylindrical tube having a top opening and a bottom opening. An upper cap overlying a top portion of the inner cylindrical tube is included. The upper cap is moveably disposed over the inner cylindrical tube. The upper cap includes a top with at least one hole defined therein. The top includes a sidewall extending therefrom. A system and a method for reducing an amount of a cleaning chemistry applied to a backside of a wafer during a cleaning operation are also provided.

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patent: 5636401 (1997-06-01), Yonemizu et al.
patent: 5868866 (1999-02-01), Maekawa et al.
patent: 6193798 (2001-02-01), Sumnitsch
patent: 6197150 (2001-03-01), Kwag et al.
patent: 6419170 (2002-07-01), Wong
patent: 6539952 (2003-04-01), Itzkowitz
patent: 6824621 (2004-11-01), Shibagaki

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