Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus – For liquid etchant
Reexamination Certificate
2005-08-30
2005-08-30
Hassanzadeh, Parviz (Department: 1763)
Adhesive bonding and miscellaneous chemical manufacture
Differential fluid etching apparatus
For liquid etchant
Reexamination Certificate
active
06936133
ABSTRACT:
A method of creating and using a polishing substrate having a coating layer is described. The method that includes providing a substrate having one or more predetermined patterns disposed on a surface of the substrate and coating the surface of the substrate with an abrasive to form a coated substrate conforming to the predetermined pattern. An apparatus enabling preparation and use of a fixed abrasive polishing member is described. The apparatus includes a patterned substrate, an abrasive coating a surface of the patterned substrate and a vacuum deposition chamber in which the abrasive is applied to the surface of the substrate. In addition, rather than a fixed abrasive, non-abrasive material may be applied to the surface of the patterned substrate, in which case, a conventional slurry may be used in planarization of an applied semiconductor wafer.
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Boyd John M.
Lacy Michael S.
Arancibia Maureen G.
Hassanzadeh Parviz
Lam Research Corporation
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