Method and apparatus for fabricating a wafer spacing mask on a s

Details Method and apparatus for fabricating a wafer spacing mask on a s Method and apparatus for fabricating a wafer spacing mask on a s

1996-10-25

1999-01-26

Nguyen, Nam

Chemistry: electrical and wave energy

Apparatus

Coating, forming or etching by sputtering

118720, 118721, 118504, 118505, 427282, C23C 1434

Patent

active

058633960

ABSTRACT:
A method and apparatus for fabricating a wafer spacing mask on a workpiece support chuck. Such apparatus is a plate containing a plurality of apertures that is positioned atop the workpiece support chuck while material is deposited onto the plate and through the apertures onto chuck. Upon completion of the deposition process, the plate is removed from the workpiece support chuck leaving deposits of the material to form the wafer spacing mask.

REFERENCES:
patent: 4704306 (1987-11-01), Nakamura
patent: 4830723 (1989-05-01), Galvagni et al.
patent: 4988424 (1991-01-01), Woodward et al.
patent: 5154797 (1992-10-01), Blomquist et al.
patent: 5223108 (1993-06-01), Hurwitt
patent: 5380558 (1995-01-01), Fujino
patent: 5405652 (1995-04-01), Kashiwagi et al.

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