Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1992-10-13
1994-01-18
Powell, William A.
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
156656, 156902, 430296, 430318, B44C 122, C23F 100
Patent
active
052797066
ABSTRACT:
A method for fabricating a metal interconnection pattern for an integrated circuit module is provided comprising the steps of: aligning only one face of the module, forming a metal layer on at least one other face of the module, applying a coating of photoresist to the metal layer, exposing predetermined portions of the photoresist to reflected radiation, and shaping the metal layer in accordance with the exposed photoresist portions.
REFERENCES:
patent: 4783695 (1988-11-01), Eichelberger et al.
patent: 4835704 (1989-05-01), Eichelberger et al.
patent: 4918811 (1990-04-01), Eichelberger et al.
patent: 4937203 (1990-06-01), Eichelberger et al.
patent: 5019946 (1991-05-01), Eichelberger et al.
Research Devices (American Optical Corp.) literature.
"Electrodeposition of Primary Photoresists", Electronic Packaging & Production, Feb. 1992, pp. 66-68.
"Powder Coatings Applied by Electrostatic Spray", S. T. Harris, The Technology of Powder Coatings, Aug. 1976, Chapter 10, pp. 171-206.
"Introduction to Photomasking", Peter Van Zant, Microchip Fabrication, 1984, Chapter 9, pp. 87-100.
"Imaging", David Elliott, Microlithography, 1986, Chapter 4, pp. 101-227.
Balch Ernest W.
Gorowitz Bernard
King William H.
Weaver, Jr. Stanton E.
General Electric Company
Krauss Geoffrey H.
Powell William A.
Skaist Howard A.
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