Method and apparatus for exposing semiconductor substrates

Details Method and apparatus for exposing semiconductor substrates Method and apparatus for exposing semiconductor substrates

2005-06-29

2008-08-26

Mathews, Alan A (Department: 2851)

Photocopying

Projection printing and copying cameras

Step and repeat

C355S066000, C355S067000, C355S068000, C355S077000, C430S030000

Reexamination Certificate

active

07417709

ABSTRACT:
Provided are methods and apparatus for exposing multiple substrates within a single exposing apparatus using only a single light source wherein a first substrate is exposed in a series of steps or shots during which light transmitted along a primary optical path is directed onto a primary surface of the substrate with the substrate being repositioned between sequential shots. A second substrate is exposed during the period of time while the first substrate is being repositioned by altering the optical path to divert the light from the light source into a secondary optical path that will expose a region on the second substrate. When the first substrate has been repositioned, the diversion of the light is terminated so that the light will again be transmitted along the primary optical path in order to expose the next sequential shot on the primary surface of the first substrate.

REFERENCES:
patent: 5359389 (1994-10-01), Isohata
patent: 5929976 (1999-07-01), Shibuya et al.
patent: 6052173 (2000-04-01), Miura et al.
patent: 6618118 (2003-09-01), Minnaert et al.
patent: 6924072 (2005-08-01), Hong et al.
patent: 2003/0197843 (2003-10-01), Mulkens et al.
patent: 1999-017136 (1999-03-01), None
patent: 1020010068643 (2001-07-01), None
English Translation of Korean Application Publication 10-2001-0068643 (dated Jul. 23, 2001).
English Translation of Korean Application Publication 10-1999-017136 (dated Mar. 15, 1999).

Affiliated with

Also associated with

Rating

Method and apparatus for exposing semiconductor substrates does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method and apparatus for exposing semiconductor substrates, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for exposing semiconductor substrates will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4006912