Method and apparatus for etching semiconductor wafers and develo

Details Method and apparatus for etching semiconductor wafers and develo Method and apparatus for etching semiconductor wafers and develo

1991-09-13

1993-02-09

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

134 33, 156640, 156655, 156657, 1566591, 156662, 156345, H01L 21306, B44C 122

Patent

active

051850567

ABSTRACT:
An apparatus for modifying, such as etching or developing, selected areas of a wafer is disclosed including a rotatable turntable upon which a wafer having a surface to be etched is mounted. A delivery nozzle for directing modifying fluid onto the wafer surface is disposed over the wafer surface at a first location. At least one structure for removing the modifying fluid, such as a vacuum nozzle is positioned over the surface of the wafer at a second location. The modifying fluid moves across the wafer surface by centrifugal force away from the first location and is removed at the second location. The surface area of the wafer between the first and second locations is modified by the etching fluid.

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patent: 5001084 (1991-03-01), Kawai et al.

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