Method and apparatus for etching film layers on large substrates

Details Method and apparatus for etching film layers on large substrates Method and apparatus for etching film layers on large substrates

1996-10-16

1999-04-20

Dang, Thi

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

With microwave gas energizing means

216 67, 118503, 118728, 118729, 414936, 414941, 414939, 438716, B05C 1100

Patent

active

058955496

ABSTRACT:
A chamber for etching substrates includes a support member therein which is suspended from a sidewall of the chamber. The support member includes multiple planar faces for receiving substrates thereon, and is rotatable about a horizontal axis to position the multiple planar faces in a horizontal position to place the substrates on the planar faces or remove the substrates from the planar faces, and a second position to place the substrates in a non-horizontal position for processing. A clamping and lifting apparatus is provided on the support member that is positionable, with respect to the support member, in an extended position to permit a substrate to be positioned between the clamping and lifting apparatus and the support member, and in a retracted position to clamp the substrate to the support member.
The chamber is especially adapted to etching substrates requiring high power densities, such as substrates having aluminum films, without causing arcing. The chamber may include: insulative members disposed between the support member and the clamping and lifting apparatus, spacers disposed in the clamping and lifting apparatus for providing a gap between the clamping and lifting apparatus and the substrates, and lift pins disposed in the support member for moving the substrates toward or away from the support member. The substrate receiving faces may be non-parallel to each other.

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