Method and apparatus for etch processing with end point...

Details Method and apparatus for etch processing with end point... Method and apparatus for etch processing with end point...

2005-01-04

2005-01-04

Hassanzadeh, Parviz (Department: 1763)

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

With measuring, sensing, detection or process control means

C118S712000, C438S009000

Reexamination Certificate

active

06837965

ABSTRACT:
A method and apparatus performing process end point detection in a semiconductor substrate processing system by monitoring for an increase in a flow of backside gas above a predetermined limit.

REFERENCES:
patent: 5622593 (1997-04-01), Arasawa et al.
patent: 6113733 (2000-09-01), Eriguchi et al.
patent: 6361646 (2002-03-01), Bibby et al.
patent: 6406545 (2002-06-01), Shoda et al.

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